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Namtech's products, such as die set molds, are active in various fields! Responding to the miniaturization of parts.
"Namtechno's products" are active in various fields, including miniaturized semiconductor-related components and electronic parts. We handle a wide range of products, including die set molds, molds for punching machines, and precision parts. *For more details, please refer to the catalog. Feel free to contact us as well.
![Daisetsu mold [High strength, high precision, long lifespan!]](https://image.mono.ipros.com/public/product/image/65e/2000689172/IPROS02262046396024362146.png?w=280&h=280)
High intensity, high precision, high-speed processing, and long lifespan! We can offer proposals from mold design to processing steps and mass production processing with press machines.
The "Daisetto Mold" is a product that can accommodate processing sizes, press equipment, material types, and production volumes that cannot be handled by QDC molds. It eliminates the need for fixtures, allowing the mold to be set directly into the press machine, and enables proposals from mold design to processing steps and mass production processing in the press machine. Additionally, there is equipment that can inspect press-punched products rolled into a coil using image processing, and cut them to standard lengths for storage. 【Features】 ■ Installation of a rigid post on the outside ■ No fixtures required ■ Mold can be set directly into the press machine ■ High strength, high precision, high-speed processing, long lifespan *For more details, please refer to the related links or feel free to contact us.
The stroke speed is 180 spm to 200 spm! Here are examples of processing done using the punching method in a progressive manner!
We would like to introduce a case study of our company's "beryllium copper punching processing" die set mold processing. The material width is 16.5mm, the material form is in rolls, and the product thickness is 0.05t. The punching method was performed in a progressive manner. We used the "Stamping Press Vrio-10" manufactured by KYORI, with a pressing capacity of 100kN and a stroke speed of 180spm to 200spm in a roll-to-roll configuration. [Processing Case Overview (Partial)] ■ Material: Beryllium Copper ■ Material Width: 16.5mm ■ Material Form: Roll ■ Product Thickness: 0.05t ■ Shape Tolerance: ±0.005 *For more details, please feel free to contact us.
With a pressing capacity of 100 kN and a stroke speed of 60 spm! An example of punching from the upper side of a paper separator.
We would like to introduce a case study of our company's "Cover Film Die Cutting" die set mold processing. The material width is 250mm in roll form. The material composition consists of a heat-resistant carrier film of 50μm, a PI film of 9μm, an adhesive layer of 20μm, and a paper separator of 150μm, with a total thickness of 229μm. We used a "SSD1000-ASF automatic press machine with linear feeding device" manufactured by Sekiguchi Seisakusho, and the punching was performed from the upper side of the paper separator. 【Overview of Processing Case (Partial)】 ■ Material Composition: Total thickness 229μm - Heat-resistant carrier film 50μm - PI film 9μm - Adhesive layer 20μm - Paper separator 150μm ■ Material Width: 250mm ■ Material Form: Roll ■ Dimensional Tolerance: ±0.1mm *For more details, please feel free to contact us.
